Smart HGCS5050 glass cutting braking machine is a new-generation intelligent laser cutting and breaking all-in-one machine launched by HG Star for the high-end precision glass processing market.
The system utilizes infrared picosecond ultrafast laser technology for high-quality, non-contact cutting, and integrates a built-in CO2 laser breaking system to achieve precise separation. It combines both cutting and breaking functions in a single unit, supporting independent or synchronized operation.
Machine is widely used in high-precision processing of ultra-thin glass, irregular-shaped glass, and high-value-added glass components.
Smart HGCS5050 Technical Parameters
| Core Parameters of Picosecond Infrared Laser System | |||
|---|---|---|---|
| MODEL | SS-T-I-60B | ||
| Central Wavelength | 1064nm | ||
| Average Power | ＞65W@30kHz | ||
| Pulse Energy | ＞2mJ@30kHz | ||
| Pulse Width | 10Ps | ||
| Table Technical Requirements | |||
| Travel Range (X*Y*Z) | 650*550*100 | ||
| Positioning Accuracy | ±1.5um | ||
| Bidirectional Repeatability Accuracy | ±1um | ||
| Max Speed (with Load) |
900mm/s |
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| Load Capacity |
20kg |
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| Processing Parameters |
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| Processing Speed |
150mm/s |
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| Single-Pass Processing Thickness |
≤8mm |
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| Applicable Materials |
Standard Glass |
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| Chipping Range |
≤10um |
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| Overall Machine Dimensions and Weight |
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| Weight |
2.5T |
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| Dimension |
1634*1372*2052 |
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Product Details Display
Ultrafast Infrared Picosecond Laser Cutting Technology
Ensures vertical cut edges and minimal internal damage, making it ideal for high-end applications.
High-Precision Bessel Cutting Head
Delivers taper-free kerfs, clean edges, and minimal chipping.
CO2 Laser-Assisted Breaking Technology
Enables more efficient processing with precise crack control and superior fracture consistency.
Integrated Cutting and Breaking Design
Saves equipment space and manual handling, offering multi-functionality in one machine with higher overall efficiency.
Industry Applications
HG Star all-in-one glass cutting and breaking machine is widely used in high-precision processing of advanced glass materials across various industries such as consumer electronics, optical components, semiconductor carriers, display panels, precision glass, glass cover plates, and 3C electronic components. It is suitable for cutting, breaking, and edge processing of ultra-thin glass, tempered glass, flexible glass, sapphire, quartz glass, and ceramic substrates.
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