Smart HGCS5050 Glass Cutting Breaking All-in-One Machine

Smart HGCS5050 Technical Parameters

Core Parameters of Picosecond Infrared Laser System
MODEL	SS-T-I-60B
Central Wavelength	1064nm
Average Power	＞65W@30kHz
Pulse Energy	＞2mJ@30kHz
Pulse Width	10Ps
Table Technical Requirements
Travel Range (X*Y*Z)	650*550*100
Positioning Accuracy	±1.5um
Bidirectional Repeatability Accuracy	±1um
Max Speed (with Load)	900mm/s
Load Capacity	20kg
Processing Parameters
Processing Speed	150mm/s
Single-Pass Processing Thickness	≤8mm
Applicable Materials	Standard Glass
Chipping Range	≤10um
Overall Machine Dimensions and Weight
Weight	2.5T
Dimension	1634*1372*2052

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Product Details Display

Ultrafast Infrared Picosecond Laser Cutting Technology

Ensures vertical cut edges and minimal internal damage, making it ideal for high-end applications.

 

 

 

High-Precision Bessel Cutting Head

Delivers taper-free kerfs, clean edges, and minimal chipping.

CO2 Laser-Assisted Breaking Technology

Enables more efficient processing with precise crack control and superior fracture consistency.

Integrated Cutting and Breaking Design

Saves equipment space and manual handling, offering multi-functionality in one machine with higher overall efficiency.

Industry Applications

HG Star all-in-one glass cutting and breaking machine is widely used in high-precision processing of advanced glass materials across various industries such as consumer electronics, optical components, semiconductor carriers, display panels, precision glass, glass cover plates, and 3C electronic components. It is suitable for cutting, breaking, and edge processing of ultra-thin glass, tempered glass, flexible glass, sapphire, quartz glass, and ceramic substrates.

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