Laser Cutting Technology: A New Breakthrough in the Manufacturing of Foldable Phones

In recent years, foldable phones have become a key consumer product in the high-end smartphone market. Its main feature is the 360-degree foldable screen, offering greater flexibility.

However, this also makes the screen more fragile, making it more susceptible to damage from external impacts.Therefore, the screen support plate of foldable phones must be as thin as possible while maintaining sufficient strength, rigidity, and toughness. Carbon fiber can meet these requirements effectively. Carbon fiber not only strengthens the structure and reduces weight, but also enhances the device’s durability, extending its lifespan.

However, processing carbon fiber materials is challenging, mainly in three aspects:

1.Carbon fiber’s high hardness causes severe tool wear.

2.Its brittleness leads to cracking, impacting product quality.

3.Low thermal conductivity causes hole shrinkage during drilling.

To meet the carbon fiber backplane processing needs of foldable phone, HGTECH leverages the advantages of non-contact laser processing to develop specialized ultrafast laser cutting equipment. This advanced technology minimizes heat-affected zones, reduces material damage, eliminates the need for post-processing, and achieves high-precision cutting of carbon fiber backplane grooves.This equipment has been certified by the mainstream market and is already in mass production at customer sites. It significantly enhances the durability of foldable phones and improves quality and efficiency for large-scale production in the industry.

1.Self-developed software platform with cutting accuracy of ±20μm.

2.Fully enclosed design with marble gantry, high-precision linear motors, and CCD positioning, achieving stitching accuracy of ≤10μm.

3.Multi-station design for doubled production efficiency.

HGTECH focuses on the high-end, digital, and intelligent development trends in the 3C electronics industry. With years of dedication to ultrafast laser processing, HGTECH has developed a range of intelligent laser processing equipment. The company is committed to providing the most advanced, comprehensive, and efficient system solutions for the next generation of smart terminal manufacturers, aiming to become a trusted global leader in 3C industry solutions.