HGTECH Fully Automatic Wafer Laser Marking Equipment

As the semiconductor industry advances, the demand for precise wafer processing and marking continues to grow. HGTECH’s fully automated wafer laser marking equipment is a key solution for the industry due to its outstanding performance and automation.

HGTECH‘s laser marking system can handle various materials, such as Si, SiC, InP, and GaAs. This versatility ensures it can be integrated into various production line.It also supports SEMI-standard markers such as letters, numbers, barcodes, and QR codes, which are essential for traceability and quality control in semiconductor manufacturing.

The equipment supports common wafer sizes (4-inch, 6-inch, 8-inch, and 12-inch) and non-standard sizes, ensuring flexibility for different production requirements. It also offers customizable light source options, allowing users to select the ideal configuration for their specific marking needs, enhancing both quality and efficiency.

Equipped with high-precision robotic arms for intelligent material handling, HGTECH’s system minimizes human intervention and reduces errors. The CCD camera alignment and automatic edge detection ensure accurate wafer positioning, improving marking precision and consistency.

The equipment includes a toxic gas monitoring system for real-time detection of hazardous gases, along with an efficient smoke extraction system to ensure a safe working environment and protect operator health.

HGTECH‘s fully automated wafer laser marking equipment combines versatility, high precision, intelligent automation, and robust safety features. It meets the growing demands for efficient and accurate wafer processing in the semiconductor industry, providing a reliable solution for both standard and custom marking applications.