On December 28th, HGTECH successfully delivered the industry’s first optical waveguide glass wafer laser processing intelligent production line to a customer in Shanghai.
Building upon extensive R&D experience and addressing the demands of the AR market, HGTECH has launched the industry’s first optical waveguide glass wafer laser processing intelligent production line. This achievement signifies a breakthrough in automation and intelligence, ushering in a new era of mass production in the AR product processing field.
The equipment utilizes HGTECH’s self-developed Laser Crack Orientation (LCO) technology, allowing real-time adjustment of the distribution of ultra-fast laser energy. This achieves directional extension of material cutting cracks, reducing the diffusion of micro-cracks.
Compared to conventional Bessel cutting technology, LCO technology improves processing quality by five times and increases the strength of processed products by over 30%. It is set to become the preferred choice for laser processing in the AR/VR sector, driving the glass processing industry towards high-end and precision processing and achieving a leap in quality.
The successful delivery of the optical waveguide glass wafer laser processing intelligent production line signifies that HGTECH now possesses mature mass production capabilities for the latest AR industry laser processing equipment. This greatly supports the AR optical waveguide industry in stepping onto a new stage of development characterized by automation, scalability, and mass production, meeting the new demands for high-quality production of intelligent terminal products.
HGTECH is a leading innovator in laser technology, committed to delivering cutting-edge solutions across various industries. With a focus on precision, efficiency, and customer satisfaction, HGTECH continues to push the boundaries of laser technology on a global scale.